Description
- Small in size with height of 137mm, using 92mm fan.
- Powerful performance, Compact fin design + powerful fan makes it capable to support chipsets up to TDP 130W.
- Offcenter heatsink structure to avoid interference with RAM.
- 4*ะค6 mm heatpipes directly in contact with CPU, absorbing and dissipating the heat more efficiently.
- Special backplate bracket and metal adapter frame makes the mounting easy and structure strong.
Specifications